Microelectronics Engineering Group

Microelectronics Engineering Group

Electronics Technology, Systems and Automation Engineering Department University of Cantabria
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Title:Behavioral Modeling for a Top-Down Design Methodology of Folded and Interpolated ADCs
Type:International Conference
Where:XXII Conference on Design of Circuits and Integrated Systems. Sevilla
Date:2007-11
Authors: Román Mozuelos
Yolanda Lechuga
Mar Martínez
Salvador Bracho
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ISBN:978-84690-8629-2
PDF File:
Abstract:
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